Item No : 1WT-S92008- Place of orgin :
China - Payment Term : L/C, T/T, Negotiable
- Min. Order : Negotiable
- Unit Price : Contact Us
- Package : Negotiable
- Update Time :
Features Specifications » 12-layer Gold-plated PCB
- Multilayer PCBs
- Number of layers: up to 12-layers
- Major material: FR-4, CEM-3 (other materials upon request)
- Min. board thickness:
- Double side: 0.2mm (7.8 mil)
- Four layers: 0.6mm (24 mil)
- Six layers: 0.8mm (32 mil)
- Eight layers: 1.0mm (40 mil)
- 10 layers: 1.2mm (48 mil)
- 12 layers: 1.5mm (59 mil)
- Maximum board thickness: 2.4mm (95 mil)
- Surface finishing:
- Flash gold plating
- Immersion gold (maximum 0.5 micrometer)
- Thick gold plating (maximum 1.0 micrometer)`
- Hot-air solder leveling
- Entek coating (OSP)
- Solder mask: LPI (wet film), thermal cured type
- Other print:
- Carbon print, peelable solder mask
- Solder mask plugged hole
- Copper thickness (finishing): 1/2 (18 micrometer) to 4 ounce (140 micrometer)
- Minimum hole size: 0.3mm (12 mil)
- Hold size tolerance (NPTH): +/- 0.076mm (3 mil)
- Minimum line width and spacing: 0.1mm (4 mil)
- Minimum solder mask clearance: 0.076mm (3 mil)
- Minimum annular ring: 0.076mm (3 mil)
- Profile and v-cut:
- V-cut, jump v-cut, CNC v-cut
- CNC-routing, stamping and beveling
- Special process: blind/buried via hole
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